ultrasonic earphone
Developed by xMEMS Labs, Cypress MEMS drivers use ultrasonic boost modulation. In other words, instead of a physical amplifier, it produces ultrasonic sound pulses and transmits them to a reverse modulator, allowing them to become sounds that humans can hear.
Ultrasonic drivers can produce perfect sound because they can copy the source sound exactly. Additionally, Hi-Res and spatial audio can also be supported. The driver package with dimensions of 6.3 x 6.5 x 1.65mm can reach 140dB low frequency sound pressure and 20Hz frequency level.
The driver, which can be much more effective than traditional methods in terms of noise cancellation, achieves much lower delays. It was stated that the ultrasonic headphones, which will be produced in partnership with TSMC, will be exhibited at the CES 2024 fair and will be released in late 2024.