Google introduced the high -speed silicone photonic chip called the expected BAARA. With the new chip, Google says forget the cables and aims to shape the future of the internet with light with the bond project. Following the seven -year development process, the unit of the roof company Alphabet X introduced the latest version of the project. The bond chip has a structure ten times smaller than the size of the first generation model. This new chip has the potential to reshape our internet connection and usage way by promising up to 20GBPS.

Data transfer with light

According to Alphabet, this chip is able to transmit the data by air using light bundles. The bond chip, which has a significant improvement compared to its previous versions, eliminates complex light routing systems and provides a more efficient data transmission. The chip carries data using light similar to traditional fiber optic cables, but the cable requirement disappears.

The new chip can direct the rays to the needed places using advanced software. In addition, it has a much smaller structure than the previous model. While the first version of the BAAR is in the traffic light size, the new chip is almost a finger -sized size, which provides a large plus for ease of use. In the first version, light was directed with the help of mirrors. Now this process is left to software.

The BAAR chip was initially developed for X’s Project Loon internet balloons. However, Alphabet decided to focus on the bounte chip by ending this project in 2021. In the meantime; This is not a theoretical project. Loon was actively used in some cities of India.

Tests were done, new version is being developed

The new chip can offer an unlimited bandwidth, thanks to its use of light as a data transmission tool. These visible wavelengths, which are located between visible light and infrared light in the electromagnetic spectrum, provide the ability to transmit data at 20GBPS per second at a distance of up to 20 kilometers from the Baura. In addition, the installation can be done quite quickly. Considering that fiber infrastructure installations may last for months or even years, a connection at this speed is a great revolution.

BAARA’s light -release units can be installed in just a few days. In the laboratory tests, the Investment Team managed to transmit data at 10 GBPS at 10 kilometers away using two new chips. Now, the team aims to increase the capacity and range of the chip by developing a new version containing thousands of light emers. Google also explores ways to overcome weather conditions and physical obstacles that can prevent transmission.

The new bond chip is expected to be available from 2026 onwards. However, it may take some time to spread this chip, especially for average users. Nevertheless, the potential of BAARA in this field is great. Considering that 3 billion people around the world still have no access to the internet, this new technology is seen as an important step to provide worldwide internet access.