Ming-Chi Kuo, an experienced Apple analyst, made a series of statements about the company’s work in the coming years. The statement made by Kuo was about the iPhone 17 series, which we expect Apple to introduce in 2025. Yes; Many of us are focused on leaks about the iPhone 16, but Ming-Chi Kuo talked about next year.
According to the analyst, the technology giant will make changes to the motherboard design of iPhones in the coming years. The company will begin using resin-coated copper, also known as RCC, instead of traditional cards. So how will Apple’s change on the motherboard affect the iPhone 17?
Battery capacity can increase significantly!
RCC motherboard offers some advantages over traditional motherboard design. For example; RCC cards have a very thin structure. This means more damage to the interior of the phone, and therefore a much larger battery. These cards are also much easier to process. The reason for this is that RCC cards do not contain fiber material in their structure.
However, RCC cards are very sensitive to drops!
Although the RCC motherboard is a hope for Apple, there are significant problems. So much so that RCC motherboards have a very sensitive structure and have poor tolerance against falling. This is actually exactly what ties Apple’s hands. Saying that Ajinomoto, one of the world’s largest RCC motherboard manufacturers, will focus on durability for a few years, Ming-Chi Kuo says that the new technology is unlikely to catch up with the iPhone 16. If Apple can achieve its goal, RCC motherboards will begin to be used first in the iPhone 17 Pro series and in all iPhone models in the following years.
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