Following the announcement of Micron’s new generation TLC NAND memory with 232 layers, Western Digital also announced that it will start production of 162 layer QLC NAND memories. The memories were developed in partnership with Kioxia.
162 layer memories ready
BiCS NAND, the company’s vertical stacking technology, will offer high capacities by using different solutions on both end-user and server-side while transitioning to its sixth generation.
232 layer NAND memory from Micron
With BiCS6 3D NAND technology, 1Tb QLC NAND memories can be integrated into a 68 square millimeter area. Especially after PCIe 5.0, high performances will be achieved. It is also stated that a single memory plate will increase from 70TB to 100TB. It was also noted that the highest data transfer rates in its class were achieved. BiCS6 3D NAND memories will enter mass production at the end of the year.
Another product of the company was 200-layer BiCS+ NAND memories. BiCS+ NAND memory, which will offer 60 percent more performance and 15 percent more bandwidth than BiCS6 3D NAND technology, is aimed at servers. Their volume production will start in 2024. The company plans to develop 500-layer NAND memories in 2032.
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