Taiwan semiconductor giant TSMC is preparing to enter a new era in chip production. While the company makes major investments for the transition to the 1NM process, it plans to establish new production facilities in Taiwan to support this revolutionary production process. The company wants to reinforce its current leadership for the next years.

TSMC has made a big difference to its competitors while maintaining its leadership in the semiconductor sector. Especially the high orders that Nvidia received for artificial intelligence chips caused a great advantage to its competitors such as Samsung and Intel. Now, the company plans to establish a production facility with the latest technology in Tainan, Tainan in order to realize its 1NM production.

The new target to reach 1nm in 2030

According to Taiwan Economic Daily, this new facility, called “Fab 25, will focus on the 12 -inch Wafer production and will have a total of six production lines. However, TSMC will build new facilities for 2nm and 1.4NM processes as well as 1NM. The incentives of the Taiwan government to the region and Tainan’s become a “semiconductor valley çalış plays an important role in making this decision.

TSMC announced last year’s IEDM conference, announced its 1NM production plans and announced that this process will be completed by 2030. In this process, the company aims to reach the “trillion transistor” level and integrate multi -layered 3D chipset technology.

On the other hand, how TSMC will manage the 1NM process is a big question mark. In the semiconductor industry, production efficiency and supply chain problems continue to be an important problem. Moreover, it is estimated that production costs will be quite high. Previously, TSMC’s 1NM plans would be expensive and estimated costs will exceed approximately $ 32 billion.