The competition in chip production, which is in great need of the whole world, has started to heat up. In this context, TSMC, Intel and Samsung, which are the leading manufacturers of the industry, have turned their focus to 3nm and 2nm technologies. Now, among these names, TSMC shared new information about the progress in 2nm technology and the 3nm node at the event held on Wednesday.Date given for 2nm production
At the event held, TSMC stated that “a great progress has been made in terms of both efficiency and device performance” in 2nm technology and that it will enter mass production in 2025 as planned. According to TSMC, 2nm technology will provide a 15 percent increase in density compared to N3E, up to 15 percent speed increase at the same power, and up to 30 percent efficiency.
As for 3nm, TSMC reports that the new node is now in mass production and the improved N3E version will enter high-volume production in the second half of 2023. At this point, Apple, one of the company’s biggest customers, plans to turn to the 3nm Apple A17 Bionic in the upcoming iPhone 15 Pro family.Following the N3E, the chip giant will continue to optimize the family’s transistor density and roll out the advanced N3P node. The date range specified for N3P is the second half of 2024. The N3X, designed specifically for high-performance computing (HPC) applications, will enter mass production in 2025.
As you know, chip manufacturers such as Nvidia, Qualcomm and MediaTek are focusing on artificial intelligence-supported automotive technologies today. At this point, TSMC says that N3AE or “Auto Early” N3E-based automotive process design kits (PDK) will be ready in 2023.
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