The possibility of trading tensions with China and US President Donald Trump will potentially increase customs duties. Trump said that he aims to move semiconductor production to the United States and expected high taxes for those who did not. According to new information in this context, TSMC accelerates the 3NM chip production road map in the USA to prevent possible commercial disruptions.

Moneydj reports that TSMC has accelerated the work for the 3nm production line planned for its second factory in Arizona. The plans were drawn 1 year early and the equipment for 3nm in 2026 will begin to be established, while mass production will begin in 2027.

TSMC is afraid of additional taxes

The current public road map of TSMC estimates that the second Arizona facility will not start producing 3nm and 2nm chips by 2028. So what’s the reason for this sudden acceleration?

The company’s internal resources say that possible customs tariffs to be applied to the import of chip from Taiwan to the United States are the main factor that triggers this acceleration. TSMC seems to be expanding its production capacity in the US in a proactive way to avoid future import taxes. In addition, the company said to increase semiconductor prices by 15 percent in order to balance the costs of possible customs duties.

TSMC’s second facility in Arizona is expected to have a monthly production capacity of 25,000 to 30,000 3nm. In the meantime, the first Arizona factory was initially planned for 2025, although it was initially planned for 2025, 4nm production began in the 4th quarter of 2024 before planned. Therefore, the second facility is expected to move to production before the successfully planned dates.

This accelerated production plan of TSMC directly affects not only the company, but also the important chip designers. Giants such as AMD, Nvidia and Apple develop new generation products by taking advantage of TSMC’s advanced production processes. In the meantime, there are speculation that TSMC can set up the first US -based developed packaging facility, which is a move to fill a critical gap in the local semiconductor supply chain.