TSMC, one of the world’s largest semiconductor manufacturers, leaves an important threshold in the 2NM N2 chip production. It is reported that the company has reached 60 percent efficiency in the trial production process. This means that the transition to full -scale mass production is now very close. According to sector sources, TSMC is likely to reach 80,000 Wafer (chipset) production capacity by the end of 2025.

TSMC presses gas at 2nm

Taiwan -based giant manufacturer’s facilities in Baoshan and Kaohsiung are critical for the mass production of 2NM chips. Initially, the trial production target, which was set for both facilities, was announced as 5,000 Wafer. However, according to Economic Daily News, TSMC can reach 50,000 wafers per month by the end of the year, given the current progress. According to the sector resources, if things go well on the TSMC side, this capacity is also possible to increase to 80,000.

However, it is stated that the demand for 2NM chip technology is much higher than 3nm. This is one of the reasons why TSMC rapidly increases its production capacity. Samsung, the company’s biggest competitor in this field, was able to reach a 30 percent efficiency rate in the trial production of Exynos 2600. This shows that TSMC reinforces the leadership in the sector. On the other hand, Intel announced that the 18a (1.8nm) process was “ready .. However, the latest information indicates that there are problems with yield. TSMC has not yet officially made a clear statement about its production capacity. The company says that the production process is progressing just as planned.