Contrary to recent claims that there will be slowdowns in innovation development due to the global chip crisis and global inflation and that Moore’s law will be shelved, Intel is determined to continue the law.Moore’s law will continue
Intel, which fell behind its competitors in new production processes and had to make a production partnership with TSMC, aims to join the competition again by taking important steps within 8 years.
Intel said in a statement that it has developed a new program until 2030 to continue Moore’s law. In this program, innovative materials with a thickness of 3 atoms will be used, while transistor densities will increase 10 times.
To overcome the limitations of the silicone material, smelters are testing different materials and using new sequencing ways to increase productivity. In the new processes, Samsung and TSMC had switched to GAA technology, which stacks multiple nano ports instead of side by side.
Intel, on the other hand, uses the technique of stacking ports up to 4nm and 3nm processes, and then plans to switch to the GAA technique. It will also increase efficiency with PowerVia rear power distribution technology and RibbonFET technology.
On the other hand, FeRAM technology, which places memory with ferroelectric capacitors on transistors, similar to the Ryzen 3D technique, and the 300-millimeter GaN on-chip technique that will allow much more efficient power transfer will also be offered to Intel customers in the near future.
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