Competition in the mobile processor market has increased considerably recently. At the Apple event to be held today evening, A17 Bionic and soon Snapdragon 8 Gen 3 processors will appear. In addition, MediaTek has moved on to the final stage for Dimensity 9300. However, it is claimed that the release of this chip will be quite problematic.
MediaTek Dimensity 9300 reportedly overheating
Evan Blass, known for his leaks in the industry, said that the upcoming MediaTek Dimensity 9300 processor overheats. As it is known, the Taiwan-based semiconductor manufacturer gave up efficiency cores in its new chip and instead included only high performance cores, 4x Cortex-X4 and 4x Cortex-A720. However, the fact that the processor is only performance-oriented seems to have lowered pre-launch expectations by causing overheating.
MediaTek Dimensity 9300 will use TSMC’s N4P process and will allegedly be introduced at an event to be held in October. However, as mentioned above, if a solution to the heating problems of the new chipset is not found, it may not be able to compete with Snapdragon 8 Gen 3 and A17 Bionic.
You can take a look at the features of the MediaTek Dimensity 7200 Ultra processor, introduced yesterday, below.
| Feature | details |
|---|---|
| Processor Architecture | 4nm |
| Processor Cores | 2 x Cortex-A715 @ 2.8GHz, 6 x Cortex-A510 @ 2.0GHz |
| GPU | Mali-G610 GPU |
| RAM Support | LPDDR5 and LPDDR4x |
| Video Recording | 4K 30fps |
| Camera Support | Up to 200 Megapixels |
| Display Support | Full HD+ (144Hz refresh rate) |
| HDR Support | 14-bit HDR image support |
| 5G Support | Yes |
| MediaTek APU | 5th generation MediaTek APU 650 |
So what do you think about this subject? Do you think MediaTek Dimensity 9300 will be able to satisfy users? Do not forget to share your views with us in the comments section.
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