According to rumors, the iPhone 15 Pro Max may have a thinner camera bump than its predecessor. This can be seen in new CAD images and related images shared in a series of tweets by Apple leaker Ice Universe.

https://twitter.com/UniverseIce/status/1629478892942798848

The iPhone’s camera bump has been bothering users for years because it causes the device to shake when placed on a flat surface. One workaround is to use a sheath to stabilize the wobble. According to the tweets, the iPhone 15 Pro Max is expected to feature thinner bezels but a thicker titanium alloy middle frame. It measures 159.86 mm × 76.73 mm × 8.25 mm and has an overall thickness of 11.84 mm including the camera bump. In comparison, the iPhone 14 Pro Max measures 160.7mm x 77.6mm x 7.85mm and has an overall thickness of 12.03mm.

This means that the overall device footprint will be smaller than the iPhone 14 Pro Max as there will be some cuts in height and width. But the numbers show that even though the main body of the 15 Pro Max is thicker, the camera bump will make the overall thickness less than the 14 Pro Max.

Another interesting point is that the volume and power buttons are not included in the images. This indicates that the 2023 flagship iPhones may have touch buttons back, similar to what we saw on the iPhone 7. In the same drawings, it is seen that the Type-C port is used instead of Lightning.