Competition in the mobile processor market has increased tremendously. It has been revealed a while ago that Qualcomm will showcase its latest flagship processor, the Snapdragon 8 Gen 1+, in May. In addition, we will see the chipset in question on a smartphone from a Chinese manufacturer soon. – Probably OnePlus –
One of the biggest rivals of the company, MediaTek, is preparing to respond to Qualcomm’s move with the Dimensity 9000+ processor very soon. In fact, some of the technical features of the chipset have emerged recently.
MediaTek Dimensity 9000+ features
The successor to MediaTek Dimensity 9000, which was introduced towards the end of 2021, will debut in the coming months. At this point, MediaTek, which adopts a name policy similar to Qualcomm, will probably call the chipset Dimensity 9000+.
Dimensity 9000+ has recently appeared in the Geekbench database. The processor will be the overclocked version of its predecessor. The chipset, which will have a 4 nm architecture, managed to score 962 points in single-core tests and 1,156 points in multi-core tests.
When we look at the Geekbench database, we see that the Cortex-X2 core of Dimensity 9000+ has been increased from 3.0 GHz to 3.2 GHz. However, it still lags behind the Geekbench scores of its predecessor.
Considering that Cortex-X2 cores cause heating in previous reports, one wonders how the overclocked MediaTek Dimensity 9000+ will perform in this regard. subject. However, according to the allegations, since the chip series is produced in partnership with TSMC, it will experience less heating problems compared to Snapdragon 8 Gen 1+.
On paper, MediaTek Dimensity 9000+ and Qualcomm Snapdragon 8 Gen 1+ have similar features. However, as it is known, things can change completely when a number of factors such as in-device optimizations and cooling solutions come into play.
So what do you think about this issue? Do you think MediaTek Dimensity 9000+ will satisfy users? Do not forget to share your views with us in the comments section or on the SDN Forum.