Micron was the first company to sample what it calls second-generation HBM3 memory, surpassing competitors such as SK hynix and Samsung. Thus, Micron has gained a critical advantage over its competitors. Because it needs the fastest and highest capacity memory in the current artificial intelligence war. Micron’s new HBM 3 Gen2 memories will also be available to customers at this point.The fastest and busiest in the world
Micron is currently offering its developed 24GB of HBM3 Gen2 memory to select customers, and the 1.2TB/s bandwidth represents a huge leap over previous generations. Micron states that HBM3 Gen2 offers 2.5 times more performance per watt than previous generations, making it ideal for artificial intelligence data centers where performance, capacity and efficiency are important.
The new 24GB HBM3 Gen2 memories increase pin speed to over 9.2Gb/s, providing up to 50 percent improvement over existing HBM3 solutions. Thus, 1.2 TB/s bandwidth is obtained on the 1024-bit bus. So this is seen as a huge improvement over the 820 GB/s found on the current HBM3. Given the current hype of artificial intelligence and the race to see who can build the biggest supercomputer, such things will give Micron’s flagship memory products a competitive edge. With the launch of 24GB HBM3 Gen2 memories, Micron adds that 36GB capacity options will begin sampling in early 2024.Nvidia is one of the first customers
As part of its roadmap, Micron lists ‘HBMNext’ as the next development beyond HBM3 Gen2. According to the company, 64GB capacity and over 2TB/s bandwidth will arrive around 2026. “Micron’s HBM3 Gen2 technology was developed with a focus on unlocking superior AI and high performance computing solutions for our customers and the industry,” said Praveen Vaidyanathan, Vice President and General Manager of Micron’s Computing Products Group. One of the first customers of Micron’s new HBM 3 Gen2 memory was Nvidia.
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