It is said that MediaTek will introduce the Dimensity 9300 chip next month, in October. This cutting-edge chip will use TSMC’s N4P process and is set to compete with the upcoming Snapdragon 8 Gen 3 and Apple A17 Bionic. However, the new chip appears to have encountered some challenges along the way.Dimensity 9300 and warming up
Evan Blass, known for his leaks, stated that the upcoming Dimensity 9300 chip overheats when running at expected clock speeds. As you may remember, Dimensity 9300 made a splash by abandoning efficiency cores and instead having a configuration consisting of 4x Cortex-X4 and 4x Cortex-A720 cores designed in a 4+4 layout. The inclusion of only high-performance cores can most likely be seen as the primary cause of chip overheating.
Looking at what happened with the Snapdragon 8 Gen 1 chip, it is clear that phone manufacturers are focusing on preventing phones from getting too hot. In fact, manufacturers quickly switched to the cooler-running Snapdragon 8+ Gen 1 as soon as it came out. Now it seems MediaTek is in a difficult situation. Most phone companies may not want to use the Dimensity 9300 if overheating issues are also experienced in the final version. Even if the clock speeds of the processor are reduced, then it may not offer enough appeal in terms of performance. In the end, it becomes a lose-lose situation. In addition, this situation may hinder MediaTek’s plans to stay ahead of the competition.
In previous reports, it was said that the upcoming Dimensity 9300 will have a minimum clock speed of 3 GHz. It was also said to be 50 percent more power efficient than the Dimensity 9200. These claims will begin to become clear in the coming weeks.
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