Working to expand its mobile processor portfolio, MediaTek introduced the Dimensity 1050 chipset in a press release. Dimensity 1050, which is a lower version of Dimensity 1100 in terms of technical features, is the company’s first processor with mmWave and sub-6GHz 5G technologies.
MediaTek Dimensity 1050 features
MediaTek Dimensity 1050, produced by TSMC with a 6nm fabrication process, has an 8-core structure. While there are two ARM Cortex-A78 performance cores running at 2.5GHz, no information was given about the others. However, according to reliable sources, 6 efficiency cores are also used.
The chipset, which hosts MediaTek HyperEngine 5.0 technology, which optimizes gaming performance and offers a more immersive experience, includes ARM Mali-G610 GPU. It also supports Full HD+ displays with a refresh rate of up to 144 Hz with hardware accelerated AV1 video decoding, HDR10+ and Dolby Vision features.
MediaTek Dimensity 1050 supports both mmWave and sub-6GHz 5G connections, so smartphone manufacturers can They can use both technologies. It also offers 3CC in the sub-6GHz (FR1) spectrum and 4CC in the mmWave (FR2) spectrum, providing up to 53 percent faster downlink speeds compared to the LTE + mmWave combination.
It is estimated that the first smartphones powered by Dimensity 1050 with Wi-Fi 6E and 2×2 MIMO antenna support will be released between July and September.
| Specifications | MediaTek Dimensity 1050 |
|---|---|
| CPU | 2x Arm Cortex-A78 @ 2.5GHz 6x efficiency cores |
| GPU | Arm Mali-G610 GPU MediaTek HyperEngine 5.0 |
| Display | FHD+, 144Hz Dolby Vision AV1 video decode HDR10+ |
| Memory | LPDDR5 UFS 3.1 |
| Display | MediaTek Imagiq 760 ISP Main camera support up to 108 Megapixels Dual HDR Video Capture |
| Modem | Integrated multimode 5G/4G modem mmWave + sub-6GHz 5G support 4CC/3CC |
| Connection | |
| Production | 6nm |
17029
