Lenovo, which has signed player phones under the name Legion today, will introduce its new flagship Legion Y70 on August 18. The new phone, whose technical details have been shared recently, has now appeared with ambitious cooling capabilities.
It will be separated from its competitors in terms of heat efficiency
Referring to the cooling system of the Legion Y70 through official channels and sharing new promotional images, Lenovo announced that the phone will come with a huge VC (Vapor Chamber) cooling system of 5,047 mm2 with a thickness of only 0.55 mm. However, the new phone, which is displayed side by side with the refrigerator in the shared images, is expected to have an extremely thin 7.99 mm profile.
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According to previous leaks, Lenovo Y70, which will be supported by Qualcomm’s next-generation platform Snapdragon 8+ Gen 1, will come with trigger keys for gamers, 68W fast charging and 16GB memory capacity. On the camera side, it will host a triple design and 50 MP main camera sensor with OIS.
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