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Intel knocked on Samsung’s door: A new cooperation can be signed

Today's giant chip manufacturers Intel and Samsung can sign a new partnership. Intel CEO Pat Gelsinger started talks with key Samsung executives.
 Intel knocked on Samsung’s door: A new cooperation can be signed
READING NOW Intel knocked on Samsung’s door: A new cooperation can be signed

Under the IDM 2.0 strategy, Intel, which has made changes in chip production and cooperated with TSMC, can go much further than TSMC in chip production.

knocked on Samsung’s door

Intel CEO Pat Gelsinger, Samsung Electronics Vice President Lee Jae-yong, chip division boss Kyung Kye-hyun, who recently visited Samsung’s South Korea headquarters and Samsung Mobile chairman Roh Tae-moon. Although no official information has been shared about the meetings held, many sources say that the two companies can sign a new cooperation.

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As it is known, Samsung, which has efficiency problems in the 4nm production process, lost Qualcomm, one of its biggest customers, to its rival TSMC. Similarly, Nvidia, one of the company’s customers, is expected to rely on TSMC instead of Samsung in its new generation graphics cards. For this reason, we can say that Intel may want to fill the vacant seats of Samsung against TSMC, which has a large customer queue.

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