Intel continues its global silicon leadership

Recently, Intel held a press conference and we were there as HardwareHaber. Meeting; It began by emphasizing Intel’s unique ability to combine software, silicon and platform, packaging and process, and scale production. Emphasis was placed on Intel’s industry leadership and innovations in the transition from CPU to XPU, from silicon to platforms, and from a traditional IDM to a more flexible IDM.

It was emphasized that the whole world has become digital and that there will be no going back. Ediz Altun, quoting Intel CEO Pat Gelsinger, talked about the four superpowers (accessible computing, widespread connectivity, cloud-to-end infrastructure and artificial intelligence) that accelerate the digitalization process and added: “These four superpowers are more connected to microchips than ever before. It will increase the world’s need for information processing by providing information processing capability. This is where Intel comes in and wins: Our semiconductors are the core technology that empowers developers and enables our customers’ innovations.”

Intel’s strategy focuses

• Product Leadership: Leading and democratizing computing with Intel x86 and XPU.
• Open Platforms: Delivering open and secure hardware and software platforms by driving industry-shaping standards.
• Scale Manufacturing: Creating world-changing technology and scale production with IDM 2.0.

The meeting continued by emphasizing the investments made and planned to implement Intel’s strategy. The importance of the European Investment Programme, which was announced in March 2022 and is part of Intel’s overall global investment, and how it will strengthen the digital future of the EMEA region, was explained.

The press conference organized by Intel under the leadership of Ediz Altun ended with the introduction of new products that reinforce Intel’s leadership in technology and advanced packaging. It is said that the next node after the 10nm SuperFin node introduced last year will be called Intel 7 and there will be big improvements in performance. For the advanced packaging area, it was announced that the new generation of EMIB technology, which is currently in production, is being worked on. It has also been announced that the new Meteor Lake product will include Foveros advanced packaging technology.