Honor will hold an event where it will introduce its new products as part of the Mobile World Congress (MWC) to be held in Barcelona between February 28 and March 3. The company will introduce a new flagship smartphone at the event it will organize.
Honor, the flagship phone is coming
With a poster shared from Qualcomm’s official Weibo account about the phone that Honor will introduce, it was revealed that the device will be supported by the flagship Snapdragon 8 Gen 1 chipset. Looking at the slogan ‘The Power of Magic’ on the poster, the upcoming device is expected to come under the Magic series.
Honor introduced Magic3 with Snapdragon 888 and Magic3 Pro smartphones with Snapdragon 888 Plus in August last year. The company recently announced its first foldable phone, the Magic V, earlier this month, and the device is powered by Snapdragon 8 Gen 1.
Considering all this, it is thought that the company will not announce a new foldable device in this short time and the upcoming phone may be called Magic4.
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