Honor is preparing to appear on the stage with new models that attract attention in the smartphone world. Particularly offering innovations in the foldable phone segment, the company is preparing to launch Magic V4 and Magic V2 Flip models. According to leaked information, these two devices come with significant improvements in design, hardware and screen technology.

The Magic V2 Flip is equipped with an advanced LTPO display and gets power from the Snapdragon 8 Gen 3 processor. Although the technical details are not yet described, the previous model is expected to offer a stronger experience, considering that the previous model comes with the 6.8 -inch LTPO OLED display and Snapdragon 8+ gene 1 processor.

On the other hand, the Magic V4 will offer a wider usage area with a 8 -inch customized LTPO screen. The device, which comes with the fingerprint reader placed on the side for security, will get power from the Snapdragon 8 Elite processor. Compared to Oppo Find N5 from its competitors, Honor will use a full 8 -core chipset on the device.

Magic V4, which also exhibits an ambitious posture on the camera, will have a 50 MP main camera and a telephoto lens. However, Periscope Telephoto Lensin is said to be the highest segment quality this time. In addition, the device is planned to be thinner than its predecessor. Considering that the Magic V3 is 9.2 mm thickness, the new model is estimated to have a more elegant structure.

Honor is expected to introduce these two foldable phone in June. These models are expected to create a strong competition in the market with advanced equipment, examined design and ambitious camera features.