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For affordable flagship phones: MediaTek Dimensity 8200 is introduced!

The new product of the Taiwanese company, which introduced the Dimensity 9200 1 month ago, was produced with a 4 nm fabrication process. Will this processor named MediaTek Dimensity 8200 be able to satisfy users with its technical features? What does the MediaTek Dimensity 8200 ...
 For affordable flagship phones: MediaTek Dimensity 8200 is introduced!
READING NOW For affordable flagship phones: MediaTek Dimensity 8200 is introduced!
The new product of the Taiwanese company, which introduced the Dimensity 9200 1 month ago, was produced with a 4 nm fabrication process. Will this processor named MediaTek Dimensity 8200 be able to satisfy users with its technical features?

What does the MediaTek Dimensity 8200 offer?

This product, which contains 8 cores, includes 1 Arm Cortex-A78 operating at 3.1 GHz, 3 Arm Cortex-A78 operating at 3.0 GHz and 4 Arm Cortex-A55 operating at 2.0 GHz.

ARM Mali-G610 MC6 will assist Dimensity 8200 with graphics. In addition, important parts such as MediaTek MiraVision 785, FHD Plus, which provides functionality up to 180 Hz, and WQHD, which contributes up to 120 Hz, will power the smartphones that are predicted to use this processor.

MediaTek Dimensity 8200 features ⚙️

Technicial Specifications MediaTek Dimensity 8200
Processor Architecture
  • 1x Arm Cortex-A78 @3.1GHz
  • 3x Arm Cortex-A78 @3.0GHz
  • 4x Arm Cortex-A55 @2.0GHz
Graphics Processing Unit Arm Mali-G610 MC6
Display Technologies
  • MediaTek MiraVision 785
  • FHD+ @ (up to 180 Hz)
  • WQHD @ (up to 120 Hz)
  • MediaTek intelligent Display Sync 2.0
  • 4K AV1 video decoding (video decoding)
Artificial intelligence MediaTek APU 580
Memory Quad-channel LPDDR5
Image Signal Processor
  • MediaTek Imagiq 785
  • 14-bit HDR ISP
  • Main (primary) camera up to 320 MP
  • Video capture with triple camera, Double Exposure and High Dynamic Range (dual exposure HDR videography)
  • 4K 60 FPS video capture
Modem
  • 3GPP Release 16 5G Modem
  • MediaTek UltraSave 2.0
  • 3CC Carrier Aggregation (200MHz) 5G sub-6GHz
Connection Technologies
  • Bluetooth 5.3
  • Wi-Fi 6E 2×2
  • Wi-Fi/Bluetooth hybrid coexistence design
Production Process TSMC N4 (4nm)

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