The competition between Samsung and TSMC, one of the world’s leading semiconductor manufacturers, is increasing day by day. In this context, we see that both companies have made new strategic decisions. Now Samsung Foundry has transferred a former TSMC employee, Lin Jun-cheng, to head the Advanced Packaging Team.Competition between Samsung and TSMC heats up
Jun-cheng, who reportedly played an important role in the development of 3D packaging technology in his 19-year TSMC career, currently sits in the executive chair of semiconductor equipment company Skytech. In addition, before TSMC, the authorized name also made significant breakthroughs in the US-based semi-auto giant Micron.
Today, 3D silicon stacking and advanced packaging technologies are seen as the beginning of a new era at the chip and system level. However, Jun-cheng will focus on the development of advanced packaging technology behind Samsung’s high-performance chipsets.
Samsung’s new decision comes after the company lost many of its customers to TSMC. For those who don’t know, Apple has turned to TSMC for its next-generation M3 and A17 processors compared to Samsung’s advanced 3nm technology. In addition, Qualcomm’s new mid-range processor Snapdragon 7+ Gen 1 will also be signed by TSMC instead of Samsung.
40072
