AMD Ryzen 9 7945HX3D tested: AMD is leading again

Receiving positive reviews from users with desktop processors with 3D V-Cache support, AMD seems to continue this success. As you may recall, the CPU giant announced that with the Ryzen 9 7945HX3D, 3D V-Cache will step into laptops. Now the first results from the flagship processor have been shared. AMD is returning to the mobile processor competition.

AMD Ryzen 9 7945HX3D tested

For those who don’t know, Ryzen 9 7945HX3D, which has 16 cores and 24 threads in a dual CCD arrangement, offers the same 5.4 GHz increased clock speed as the standard 7945HX and a 200 MHz lower base clock of 2.3 GHz. Each CCD of the CPU carries 32MB of L3 cache for a total pool of 64MB. However, one of these CCDs has 64.0 MB of 3D V-cache stack. Thus, the total amount of cache increases to 128 MB.

Previously, AMD announced that the Ryzen 9 7945HX3D offers up to 53 percent performance gains compared to the base model. So what do the preliminary reviews say? Let’s take a look at what the new processor offers in Cinebench, The Witcher 3, GTA V, Final Fantasy XV, Dota 2 Reborn, Strange Brigade and X-Plane 11.11 applications…

When we look at the table, we see that the Ryzen 9 7945HX3D and RTX 4090 supported ROG Strix Scar 17 achieved a score of 98 percent. Next in the list are Intel’s flagship mobile processors, the i9-13980HX, 13950HX and 13900HX-H models. The Ryzen 9 7945HX, which does not have 3D V-Cache support, has a score of 73 percent.

Therefore, AMD has managed to increase the performance of the processor up to 98 percent. Let me point out that this is too high to be ignored. Another Cinebench test shows that the Ryzen 9 7945HX3D has a multi-core score of 31,617. Thus, the processor positioned just below the Ryzen 7950X3D managed to become the fastest mobile CPU.

As exciting as this is, there is an interesting caveat due to the nature of the 3D V-Cache layer. Unfortunately, it is not possible to apply any liquid metal to the chip. For those who don’t know, AMD Dragon Range series mobile processors have a structure that lacks integrated heat spreaders, unlike the desktop “Raphael” X3D series. Therefore, it brings problems such as cooling and noisy operation of the fan.