Due to US embargoes, Huawei, which had to obtain permission to manufacture in 10nm and further processes, had to revert to 14nm and older processes. However, it works tirelessly for more efficient chips.
3D chip attack from Huawei
As in the proverb, bad neighbor makes a home, China has started to advance faster in chip design thanks to the countries that take sides against it. Manufacturers looting second-hand casting equipment are working on more efficient chip technologies.
Giant chip move from China
Huawei’s patent A new technology it took is shaped on 3D chip design. The layers are stacked not in full 3D, but with the edges out. One layer is also stacked upside down for better connectivity.
In this way, more layers and transistors are stacked on the chip, even though it is a 14nm process. It can also access memory and storage drive more efficiently. Thus Moore’s law continues.
It will be possible for Huawei to produce more competitive chips in production processes that are not subject to the embargo. It is currently continuing the construction of a facility that will cast with SMIC with advanced packaging technologies. It is likely that new 3D Kirin chipsets will come to life in these facilities.
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