Intel, AMD and ARM team up for a universal chip communication

In the chip world, the idea of ​​placing multiple silicon membranes in the same package has been studied for years. The multi-chip module design, also known as MCM, can offer advantages such as higher bandwidth and lower performance loss. However, inter-membrane communications still remain a problem to be solved.

Universal membrane connection technology is being developed

MCM designs go back many years and it is possible to see the first examples such as IBM POWER5 MCM. Today, while AMD includes multi-dice designs on the processor side, Intel has gradually started to adopt this idea.

This week, the giants of the chip world came together and announced that they have started working to develop a universal membrane communication solution. Many industry rivals such as Intel, AMD, ARM, Samsung, TSMC, Google, Meta, Microsoft are in the formation.

The universal membrane communication technology called UCIe is built on the basis of open source interface connection – AIB. Actually, it was Intel that matured the technology, but then decided to hand it over to the consortium.

Being an open source technology, it will be possible to create a universal communication language between multiple dice designs. This will encourage the emergence of new generation innovations faster. This year, the consortium aims to set various standards by upgrading the technology from the first generation to the second generation.