Intel is one step closer to fabrication technology leadership. The tech giant has completed the development of chips for customers of the Intel Foundry Services (IFS) division, along with the Intel 18A (1.8nm) and Intel 20A (2nm) manufacturing processes for use in the company’s own products.Intel China boss Wang Rui said at an event that the company has completed the development of Intel 18A (18 angstrom class) and Intel 20A (20 angstrom class) production processes. Meanwhile, completion of development does not mean that these processing processes are ready to be used in commercial productions. Rather, it means that Intel has set all specifications, materials, requirements and performance targets for both technologies.
Intel aims for industry leadership
Intel’s 20A manufacturing technology will use the GAA (Gate-all-around) RibbonFET transistor architecture. These transistors can be considered as successors of FinFET. But here the transistors are both smaller and their transitions are faster. So these are expected to affect performance. Intel states that this production process will provide a 15 percent performance increase per watt and aims to put it into production in the first half of 2024.Intel’s 18A manufacturing process will further enhance the company’s RibbonFET and PowerVia technologies, as well as shrinking transistor sizes. It seems that the development of this node is going so well that Intel has already cut its targets from 2025 to the second half of 2024. When the company enters high-volume production (HVM) in the second half of 2024, it expects 1.8nm-class fabrication technology to be the industry’s most advanced node.
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